MOLDING DIE FOR SEMICONDUCTOR DEVICE AND MARKING METHOD

摘要

PROBLEM TO BE SOLVED: To omit a marking process, to shorten the time of marking content change work and to reduce cost. SOLUTION: A projecting/recessed mask 11 is installed on a marking face metallic mold 10a among forming molding dies forming the resin mode package of a semiconductor device by using a mask setting jig 14. A jig fixing groove 12 for installing the mask setting jig 4 is formed in the marking face molding die 10a. Projecting/recessed parts corresponding to the content of a mark to be added to the surface of the resin mold package is formed on the projecting/ recessed mask 11 and a mark content can be added at the same time as molding forming, and therefor a marking process executed after molding forming can be omitted. Since the projecting/recessed mask 11 can be exchanged in accordance with the mark content, time required for the change of the mark content can be shortened and cost can be shortened.