WIRING PATTERN INSPECTION METHOD, AND ITS DEVICE

摘要

PROBLEM TO BE SOLVED: To detect defects with high accuracy by detecting defects in accordance with the defect detection standard based on the wiring direction set for each area for inspection divided based on the wiring direction of an excellent image to suppress the excessive detection of defects. SOLUTION: A candidate defect is detected from the differential image between an image of a work to be inspected and the image of an excellent work of the same type as the work to be inspected. A defect is detected from the candidate defect in accordance with a defect detection standard based on an area for inspection divided based on the wiring direction of the image of an excellent work and the wiring direction set for each area for inspection. This means that a candidate defect can be detected through the deviation in image from the image of the excellent work even if the work to be inspected is excellent. The characteristic of the candidate defect to be eliminated is different by each area for inspection. For example, candidate defects 1k, 1l and 1m are present in a wiring area 22 in the transverse direction while only one candidate defect 1m comprises two or more pixels in the direction other than the transverse direction. Thus, the candidate defects 1k and 1l are eliminated for the possibility of excessive detection.