MULTI-CHIP SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A multi-chip semiconductor package is provided to greatly reduce a defect caused by a lead transformation, by preventing an inner lead from being twisted by outer force transferred from the exterior. CONSTITUTION: A lead frame(200) includes a conductive strip body(210), an inner lead(230) and an outer lead(220). The inner lead is established in each molding region(240) formed in the strip body. The outer lead is established outside the molding region. After a semiconductor chip is electrically connected to the inner lead, at least two lead frames are stacked for molding. The lead frame is established outside the molding region and anti-transformation unit of a lead is formed between the inner lead and the outer lead.