| 摘要 |
A semiconductor dynamic sensor comprises a sensor chip (5) having a component movable according to an applied dynamic force, and a substrate (3) for mounting and supporting the sensor chip. The sensor chip outputs a sensor signal in response to an amount of movement of the movable component and is connected to the substrate via an adhesive film (4). An Independent claim is also included for the manufacture of a semiconductor dynamic sensor comprising: (i) sticking the adhesive film to a semiconductor wafer having the sensor chips; (ii) dicing the wafer together with the adhesive film into individual sensor chips; and (iii) connecting the sensor chip to the substrate via the adhesive film. |
