| 摘要 |
PROBLEM TO BE SOLVED: To prevent the thermal damage on chip components and realize a reduced power consumption with avoiding poor soldering. SOLUTION: The soldering apparatus 3 for soldering a BGA 1 on a printed board 2 comprises a first heating means 10 having a heat shielding case 11 covering the BGA 1, a lamp for heating the interior of case 11, a blower 13 for converting heat A radiated from the lamp 12 into hot air B and circulating it in the case, a heat shield plate 14 for defining a diffuser of the hot air B with the case inner wall, and blow holes 16 opened on the bottom of the BGA 1 for directly jetting the hot air B on solder bumps 1a; and a second heating means 20 having a reflector 21 for reflecting and condensing lights C of the lamp 12 to convert into an optical beam D, and a prism 22 for deflecting the light beam D in a specified direction to directly irradiate the solder bump 1a. |
