| 摘要 |
PROBLEM TO BE SOLVED: To enable good bonding by increasing a friction coefficientμ1 between a chip suction surface 60 and a chip 20, keeping the friction coefficientμ1 between the chip suction surface 60 and the chip 20 of a bonding tool higher than the friction coefficientμ2 between a substrate 30 and a bump 61, preventing misalignment of the chip, and by applying ultrasonic vibration efficiently for heating a bump part. SOLUTION: The present invention adopts the following means in a bonding apparatus. Firstly, the bonding tool is provided with a suction means for sucking the chip. Secondly, a means for applying ultrasonic vibration to the bonding tool is provided. Thirdly, a substrate holding means for holding a substrate in a stage is provided. Fourthly, in the bonding apparatus, ultrasonic vibration is applied to the bonding tool and the chip is bonded on the substrate. Fifthly, a chip suction surface of the bonding tool is formed into a concave surface or a convex surface.
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