发明名称 POLISHING TOOL, POLISHING DEVICE AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing tool, a polishing device and a polishing method for uniform polishing work with a polishing pad even if the polishing pad has a poor plane. SOLUTION: When the polishing device containing a polishing tool having a polishing pad 3 held on one face of a thin material 1 extending in the form of one plane is used to polish a machined face of a work 4 held on a work holder 5, the polishing method is adopted in which (A) a guide link 7 is mounted on the work holder 5 so that its polishing plane is flat with the machined face of the work, (B) the machined face of the work 4 and the polishing plane of the guide link 7 are pushed against the polishing pad 3 with a fluid having the same pressure, and (C) the polishing pad 3 is moved relative to the work 4. If required, a portion 3a of the polishing pad 3 is pushed against the machined face of the work 4 using the pressure of the fluid in polishing work.
申请公布号 JP2001179613(A) 申请公布日期 2001.07.03
申请号 JP19990362615 申请日期 1999.12.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHINGU KATSUKI;OTSUKA KYO;YASUHIRA NOBUO;KAWA TOMOHIRO
分类号 B24B37/005;B24B37/04;B24B37/12;B24B37/27;B24B37/28;B24B37/30;H01L21/304 主分类号 B24B37/005
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