| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a soldering method which can prevent the peeling phenomenon of a reflow soldered section at reflow soldering, and an electronic circuit board and an electronic apparatus using the method. SOLUTION: In the soldering method which performs reflow soldering to one side of the board 5 and performs flow soldering by bringing jet flow solder into contact with the other side of the board 5, the composition or fusing points of solder alloys in reflow soldering and flow soldering are varied, or arranged so that the temperature of the reflow soldered section 2 does not reach the solid-phase line temperature under a low fusing point alloy temperature, or that the temperature of the reflow soldered section 2 comes to a liquid-phase line temperature over the high fusing point alloy temperature, by providing a heat-insulating member 16 at, for example, the rear side of the reflow soldered section 2. As a result, the peeling phenomenon is not generated at the reflow soldered section. The reference numeral 7 shows a reflow soldered face mounting part, the numeral 8 shows a flow soldering face mounting part, the numeral 9 shows a lead soldering part, and the numeral 24 shows an adhesive.</p> |
