| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a curable composition which gives an excellent cured film satisfactory enough in characteristics such as electric insulation properties required by a resist for printed circuit boards, resistance to PCT (pressure cooker test), adhesiveness, soldering heat resistance, chemical resistance, and resistance to electroless gold plating. <P>SOLUTION: This curable composition comprises a carboxyl-group-containing photosensitive resin (A), a photopolymerization initiator (B), a photosensitive (meth)acrylate compound (C) and a diluting solvent (D). The carboxyl-group-containing photosensitive resin (A) is prepared by reacting a reaction product (c) of a compound (a) having at least two phenolic hydroxyl groups with a cyclic carbonate (b) with an unsaturated-group-containing monocarboxylic acid (d) and/or its ester (e) and then reacting the resultant product (f) with a polybasic acid anhydride (g). Preferably, the curable composition further contains an epoxy resin (E) and a curing catalyst (F) and may further contain a resin (G) having carboxy groups. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
