| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a slit coat method capable of stably providing a liquid coating film at a providing area of non-rectangular shape such as circular shape. <P>SOLUTION: In a coating head using a slit coat method in which the liquid coating film is formed on a substrate, two L-shaped lip members are relatively movable in a slit width direction and width of a delivery port of the coating liquid, i.e., the slit width is made to be a variable structure. In order to form the film thickness of the liquid coating film to be coated, the coating area is uniformly coated with the coating liquid while a feed amount of the required coating liquid, the width of the delivery port and a speed (coating speed) for relatively moving the coating head against the substrate are synchronized. The shape of the coating area coated with the coating liquid is made to be a non-rectangular shape such as a circular shape on a semiconductor wafer substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
