| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder ball array mask which can allocate solder balls onto an electrode pad with excellent controllability, and to provide a method of manufacturing a semiconductor device using such a mask. <P>SOLUTION: A solder ball array mask 22 has a recess 22a for performing allocation and retention of a solder ball 26, and provides a hydrophobic coating film 24 which has water-shedding and hydrophobic properties and consists of a hard carbon film or others on the top surface of the recess 22a. The manufacturing method comprises a step to form a barrier metal 18 on an electrode pad 14 of a semiconductor substrate 12, a step to form a solder ball retention layer 20 on the barrier metal 18 and remove a part of solvent in the solder ball retention layer 20 through the heating process, and a step to allocate the solder ball 26 arranged at the recess 22a on the solder ball array mask 22 and the electrode pad 14 on the semiconductor substrate 12 so that they are faced with each other. <P>COPYRIGHT: (C)2007,JPO&INPIT |
