| 摘要 |
PURPOSE: To readily and electrically connect a semiconductor element with a board and also to reduce the thickness of a semiconductor device and miniaturization of the device, even in the case where the element has a sealing inhibited region. CONSTITUTION: This method electrically connects a semiconductor element 20 with a circuit board 30, an electrical connecting sheet 40 for enabling electrical connection of the element 20 with the board 30 is arranged on the board 30, the region, where is the region to fulfill the function of the element 20 and corresponds to a sealing inhibited region 23, being inhibited as sealing of the element 20 of the board 30, is punched along with a sheet 40 to form a punched hole 50, and the element 20 is arranged on the board 30 via the sheet 40 to electrically connect electrodes 29 situated, at the remaining parts other than the region 23 of the element 20 with electrodes 33 on the board 30. |
