OPTICAL SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor package of a lead frame type which realizes low thermal resistance. SOLUTION: This optical semiconductor package 1 is provided with a lead frame 13, a translucent member 16 and a light shielding resin molded member 14. The lead frame 13 consists of a metal segment 11 which mounts an optical semiconductor element 22 on a mounting region of a main surface and is electrically connected with the optical semiconductor element 22 through conductive adhesive agent 24, and a metal segment 12 electrically connected with the optical semiconductor element 22 through a metal wire 26. The light transmitting member 16 is formed of translucent resin and arranged so as to cover the optical semiconductor element 22. The light shielding resin molded member 14 is formed of light shielding resin, and has a bottom part retaining an inner lead part of the lead frame 13 and a side part retaining the translucent member 16. In the metal segment 12, a back region corresponding to the mounting region mounting the optical semiconductor element 22 is exposed outside penetrating a bottom part of the light shielding resin molded member 14 and made a first heat dissipating region.