发明名称 Surface-mount packaging for chip
摘要 A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very easy to find a initial pin from among the plurality of pins of the chip.
申请公布号 US7365419(B2) 申请公布日期 2008.04.29
申请号 US20060309540 申请日期 2006.08.18
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 HSIEH MING-CHIH
分类号 H01L23/544 主分类号 H01L23/544
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