发明名称 |
Heat sink tab for optical sub-assembly |
摘要 |
The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).
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申请公布号 |
US7365923(B2) |
申请公布日期 |
2008.04.29 |
申请号 |
US20050042541 |
申请日期 |
2005.01.25 |
申请人 |
JDS UNIPHASE CORPORATION |
发明人 |
HARGIS MARIAN C.;HANLEY MICHAEL FRANCIS;MOON JAMES ROBERT |
分类号 |
G02B7/02;G02B6/36;G02B7/00;G02B26/06;G12B15/06;H05K5/00;H05K7/20 |
主分类号 |
G02B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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