| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed board unit which enables a user to easily visually confirm that an underfill agent that is to be filled into a gap between the rear surface of an area array type LSI package such as BGA and the surface of a printed board has been filled into the entire gap and which can consequently prevent a connection failure of the area array type LSI package. <P>SOLUTION: The printed board unit 10 is equipped with a printed board 11, electronic components 12 and 20 to be mounted on the printed board 11 by a plurality of area array-shaped electrodes, the underfill agent that penetrates from one end of the electronic components 12 and 20 to the other end of the electronic components 12 and 20 to fill them, and a mounting member for covering the other end of the electronic components 12 and 20, wherein the mounting member is equipped with an opening part 33 near the other end of the electronic components 12 and 20. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
