| 摘要 |
PROBLEM TO BE SOLVED: To provide a phosphorus-based curing accelerator-impregnated porous inorganic substance prepared by impregnating fine porous inorganic particles used as an inorganic filler for epoxy resin compositions with a phosphorus-based curing accelerator, to provide an epoxy resin composition containing the same, and to provide a semiconductor device. SOLUTION: This epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) a curing accelerator is characterized by using a latent curing accelerator prepared by impregnating fine porous inorganic particles having an average particle diameter of 4.0 to 10.0μm, a specific surface area of 280 to 700 m<SP>2</SP>/g and an oil absorption of 70 to 350 ml/100g with the curing accelerator. COPYRIGHT: (C)2009,JPO&INPIT
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