发明名称 MOLD DEVICE AND PRODUCTION METHOD FOR RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To achieve efficiency of a work for taking out a loop-shaped resin molded article from a mold.SOLUTION: A mold device 10 is a device for molding a door weather strip 80 having an inner peripheral undercut. A slide 28 of a leading processing mechanism 22 moves in a direction of separating from a first part of the inner peripheral undercut of the door weather strip 80, when a stationary side mold plate 14 separates from a stationary side fitting plate 12 with a movable side mold plate 18, in a state that the stationary side mold plate 14 and the movable side mold plate 18 are closed. A relief operation piece 40 of a following processing mechanism 32 projects from the movable side mold plate 18 toward the stationary side mold plate 14 and moves obliquely so as to separate from a second part of the inner peripheral undercut, when the slide 28 separates from the first part of the inner peripheral undercut, and then the slide is protruded by an ejector pin 36 in a state that the stationary side mold plate 14 and the movable side mold plate 18 are opened.SELECTED DRAWING: Figure 3
申请公布号 JP2016087919(A) 申请公布日期 2016.05.23
申请号 JP20140224533 申请日期 2014.11.04
申请人 SEGAWA CHEMICAL INDUSTRY CO LTD 发明人 SEGAWA KEN
分类号 B29C33/44;B29C45/44 主分类号 B29C33/44
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