| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of promoting heat dissipation of a heating element, while suppressing heat transmission among a plurality of heating elements of different amount of heat generation.SOLUTION: An electronic component 100 includes an electronic substrate (substrate) 10, a ground area 20 arranged on the outer periphery of the substrate 10 and having an opening 21 and a heat transmission body 22 having conductivity, a first heating element 30, and a second heating element 40 having a lower amount of heat generation than the first heating element 30. The electronic component 100 is attached in the external packaging 200, and a heat dissipation material 50 is provided between the first heating element 30 and external packaging 200, so as to come into contact therewith, respectively. The first heating element 30 is arranged near the center of the substrate 10, and the second heating element 40 is arranged closely to the ground area 20 while spaced apart from the first heating element 30 by a predetermined distance.SELECTED DRAWING: Figure 1 |
