| 摘要 |
PURPOSE:To improve operation efficiency, by admitting an adsorptive surface convex portion of a jig for bonding a semiconductor for vacuum adsorbing a semiconductor element into a concave portion of the semiconductor element and by positioning the convex portion, by adsorbing the semiconductor element, by carrying the jig to a bonding portion and by joining the element and the bonding portion. CONSTITUTION:A projection 7 is mounted on an adsorptive surface of a semiconductor element of a vacuum adsorptive jig 6. A hole 8 conforming to the projection 7 is drilled to a semiconductor element 9 so that the adsorptive surface of the semiconductor element of the vacuum adsorptive jig 6 not contact with a surface of the semiconductor element. The operation efficiency of semiconductor element bonding is improved because the use of such a vacuum adsorptive jig 6 eliminated the need for exchanging vacuum jigs even if the semiconductor element change. |
