Corrosion resistance in air bearing surfaces

摘要

A method includes identifying a microelectronic device located at an air bearing surface. The method further includes identifying a resistive heating element electrically isolated the said microelectronic device; applying a bias current through the resistive heating element to generate localized heat to heat the microelectronic device; identifying a predetermined humidity threshold and a separation distance between the microelectronic device and the resistive heating element in at least one dimension; measuring an ambient temperature at the air bearing surface; measuring an ambient relative humidity at the air bearing surface; determining an effective temperature; and adjusting the bias current to heat the microelectronic device to the effective temperature. The resistive heating element is one of a plurality, and at least two of the plurality of resistive heating elements are powered from a common source such that at least two of the resistive heating elements are commonly controllable via a common source.

主权项

1. A method comprising the steps of:
identifying a microelectronic device, said microelectronic device being located at an air bearing surface; identifying a resistive heating element, said resistive heating element being electrically isolated from said microelectronic device; applying a bias current through said resistive heating element to generate localized heat; heating said microelectronic device by said localized heat; identifying a predetermined humidity threshold; identifying a separation distance between said microelectronic device and said resistive heating element in at least one dimension; measuring an ambient temperature at said air bearing surface; measuring an ambient relative humidity at said air bearing surface; determining an effective temperature for which relative humidity at that region of said air bearing surface where said microelectronic device is located is reduced below said predetermined humidity threshold, based on said ambient temperature and said ambient relative humidity; determining an effective temperature rise, based on said ambient temperature and said effective temperature; and adjusting said bias current such that said microelectronic device is heated at least to said effective temperature by increasing said bias current such that said microelectronic device is heated by at least said effective temperature rise; and, wherein: said resistive heating element and said microelectronic device are distinct structures; said resistive heating element comprises a thin film resistor; said resistive heating element is one of a plurality of resistive heating elements; at least two of said plurality of resistive heating elements are powered from a common source such that said at least two of said plurality of resistive heating elements are commonly controllable via said common source.