Soldering method and method of manufacturing semiconductor device

摘要

Provided is a soldering method through nickel plating layer to reduce void occurrence rate and a method of manufacturing semiconductor device by using the soldering method. By heating a copper base plate having a nickel plating layer at a temperature range of 300° C. to 400° C. in an inert gas atmosphere beforehand, void occurrence rate can be reduced in soldering the copper base plate to an insulating circuit board.

主权项

1. A soldering method comprising:
heat treating a member having a nickel plating layer including hydrogen in a heat treating temperature range of 300° C. to 400° C. in an inert gas atmosphere, thereby reducing a nickel oxide film on a surface of the nickel plating layer; disposing a solder between the heat-treated member and a joined member; and joining the heat-treated member to the joined member with the solder in a reducing gas atmosphere at a second temperature lower than the heat treating temperature.