| 摘要 |
The invention relates to a multi-functional housing (1) for electronic components (10) for carrying out at least one first and a second function, to an electronic component (10) having a multi-functional housing (1) of this type, to an electronic circuit (11) having a component (10) equipped in this way, and to an electronics housing (13) comprising a component (10) equipped in this way. The multi-functional housing (1) comprises a heat-conducting open casing (2) having an open side (21), wherein the casing (2) is adapted to an outer shape of the electronic component (10) for the creation of a detachable connection (A) with the electronic component (10), wherein, after the creation of the connection (A), the casing (2) is provided for the thermal coupling of the electronic component (10) to the casing (2) and the cooling of the electronic component (10) as a first function, and is designed to be suitable for the retaining of fluid on a surface of the component as a second function. The housing (1) permits electrical components (10) in an electronic circuit (11) to be equipped in such a way that a secure electronic circuit (11) can be achieved having a longer life and as low as possible a number of components. |
