POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing device whose running cost is reduced by utilizing a polishing pad effectively. SOLUTION: A grooving device 2 is provided on the base body 105 (polishing device body) of a polishing device 1, and a polishing pa 3 having thickness of 5 mm or more is used. First and second pedestals 4 and 5 are fixed at positions holding a platen 103 therebetween on the upper face of the base body 105, and the grooving device 2 is mounted on the first and second pedestals 4 and 5 detachably therefrom. A cutter 6 which is a cutting edge as a grooving device 2 and a slide way 7 (cutting edge moving device) are provided by moving the cutter 6 on the straight line passing though the rotation center C of a platen 103 driven rotatably to form a closed curve like or spiral groove. The thickness t of the polishing pad 3 is 15 mm.