| 摘要 |
PURPOSE:To enable a highly reliable semiconductor device to be manufactured while preventing a protrusion of semiconductor elements from being damaged by a method wherein the semiconductor elements are covered with chip covers. CONSTITUTION:Within a semiconductor device 7, a heat dissipation sheet 1, insulation substrates 2, outer electrodes 3, 4, low thermal expansion metals 5a, 5b and semiconductor elements 6 are contained in an enclosure case 8 while the semiconductor elements 6 are covered with chip covers 11. Next, the case 8 is filled with a gelatinous resin 9 and a mold resin 10. Through these procedures, any compression by the contraction of resins 9, 10 can be relieved by the chip covers 11. |
