发明名称 PREPARATION OF MULTILAYER PRINTED WIRING BOARD
摘要 <p>PURPOSE:To enhance positioning accuracy and working efficiency by a method wherein an upper plate and a lower plate are bonded in an openable and closable manner at the end parts thereof and the upper plate is brought to an open state to fit the projections of the lower plate in the positioning holes of an inner layer core material and the inner layer core material is laminated and fixed to a prepreg through fixing holes in such a state that the projections are fitted in the positioning passing holes of the upper plate. CONSTITUTION:An upper late 11 and a lower plate 12 are fastened in an openable and closable manner at the bonding parts 20 of the end parts thereof. Positioning passing holes are opened to the lower plate 12 at four places other than fixing passing holes 12a... and projections 13... are provided to said holes in an upwardly protruding state. Fixing passing holes 11a... and positioning passing holes 11b... are opened to the upper plate 12. Positioning holes 14b... are opened to a laminate 14 along with fixing holes 14... on the basis of the holes for the exposure of a circuit pattern. The laminate 14 is set to the lower plate 12 in a laminated state by fitting the projections 13... of the lower plate 12 in the holes 14b... of the laminate 14 and the upper plate 11 is closed by fitting the projections 13... in the positioning passing holes 11... and laminated and fixed to the laminate 14 by the solder or eyelet in the holes 14a...of the laminate 14 through the fixing passing holes 11a....</p>
申请公布号 JPH0357646(A) 申请公布日期 1991.03.13
申请号 JP19890194635 申请日期 1989.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 URAKUCHI YOSHINORI;WATANABE KIMIKATSU
分类号 B32B37/16;B32B15/08;B32B38/00;B32B43/00;H05K3/46 主分类号 B32B37/16
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