| 摘要 |
PURPOSE: A copper plating apparatus is provided to enable easy manufacture and save manufacture cost by having a copper ion supplying device with simple structure. CONSTITUTION: A copper plating apparatus includes a plating tank(10), the first current device(20) and a copper ion supplying device(30) for supplying Cu2+ to the plating tank(10). The copper ion supplying device(30) has an electrolyte tank(32) for storing an electrolyte, a membrane(36) in the electrolyte tank(32) for partitioning the electrolyte tank(32) into the first and second spaces(33,34) and the second current device(40) for applying current to the electrolyte. A copper anode(42) of the second current device(40) is isolated from a copper cathode(42). The first space(33) has an outlet(39) at one side. The outlet(39) is connected to a feed pipe(38) with one end connected to the electrolyte tank(10). Operation of the second current device(40) causes the copper anode(42) to melt, and Cu2+ from the copper anode(42) is supplied to the plating tank(10) via the feed pipe(38).
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