发明名称 POLISHING METHOD
摘要 PURPOSE:To obtain a polishing method capable of reproducing same polishing conditions and having no surface contamination. CONSTITUTION:In the method polishing the surface of a sample in a specular state, the surface of a sample 6 is polished by pressing it to the sample 6 while rotating a rotating disk 5 formed with a carbon material.
申请公布号 JPH04275869(A) 申请公布日期 1992.10.01
申请号 JP19910037280 申请日期 1991.03.04
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SEMURA SHIGERU
分类号 B24B1/00;B24B37/20;B24B37/24;B24D99/00 主分类号 B24B1/00
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