发明名称 FRAME FOR ELECTRONIC-COMPONENT MANUFACTURE USE; MANUFACTURE OF ELECTRONIC COMPONENT USING IT; ELECTRONIC COMPONENT MANUFACTURED BY SAME MANUFACTURE
摘要 PURPOSE:To prevent burrs from appearing on a lead frame by a method wherein the outer shape inside a plane of a frame is prescribed substantially by the frame which is sandwiched between an upper metal mold and a lower metal mold. CONSTITUTION:A resin sealing region A is prescribed roughly by the following: narrow-width longitudinal section bars 4a composed of definite length parts in the axis-line direction; and transverse section bars 5,... which are extended collectively by a prescribed length to the transverse direction from the longitudinal section bars 4a. A frame 1 is formed of a conductive material which is soft as compared with a material of which a metal mold is formed. Consequently, in a state that an upper metal mold and a lower metal mold 8, 9 have been fastened, a gap is not formed between the surface of the metal mold surrounding their cavities 10, 11 and the longitudinal section bars 4a,... or the transverse section bars 5,... which are sandwiched and pressed by it. As a result, a thin burr is not produced at a resin package P formed in the resin sealing region A.
申请公布号 JPH04276648(A) 申请公布日期 1992.10.01
申请号 JP19910064035 申请日期 1991.03.04
申请人 ROHM CO LTD 发明人 MURAKAMI TADASHI;KOKADO YUJI;AOKI YASUNORI
分类号 H01L21/56;H01L23/48 主分类号 H01L21/56
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