| 摘要 |
PURPOSE:To provide a maleimide resin composition capable of molding in a short time without remarkable mold stain, excellent in mold release characteristics and moldability and capable of producing a semiconductor device excellent in thermal resistance and moisture-resistance reliability by encapsulating semiconductor elements. CONSTITUTION:Maleimide resin is blended with 10-50wt.% phenolic resin. Based on the total amount of the resultant mixture, 0.1-10wt.% curing catalyst composed of a basic catalyst (e.g. organophosphine compound or imidazole compound), etc., and 10-50wt.% peroxide (e.g. di-t-butylperoxide or dicumylperoxide) is blended. |
