发明名称 Integration scheme for avoiding plasma damage in MRAM technology
摘要 A method of fabricating a magnetic memory device and a magnetic memory device structure. A buffer insulating layer is deposited over the top surface of the conductive hard mask of a magnetic memory cell. The buffer insulating layer is left remaining over the conductive hard mask top surface while the various material layers of the device are patterned and etched. The buffer insulating layer prevents the conductive hard mask top surface from being damaged during plasma-containing processes.
申请公布号 US6806096(B1) 申请公布日期 2004.10.19
申请号 US20030464226 申请日期 2003.06.18
申请人 INFINEON TECHNOLOGIES AG 发明人 KIM WOOSIK;LEE GILL YONG
分类号 H01L27/22;H01L43/12;(IPC1-7):H01L21/00 主分类号 H01L27/22
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