| 摘要 |
PURPOSE:To provide a package having a shielding function though the package itself, in which a semiconductor chip is formed, is formed of a non-conductive material. CONSTITUTION:In a semiconductor package, which is provided with a lead frame 2 comprising lead pins 2a, a package, in which a semiconductor chip 3 and one part of the lead frame 2 are housed and which is formed of a non- conductive material, and a conductive shielding member 7 mounted on the surface of the package, the member 7 is fixed by being retained on one part of each lead pin 2a. |
