| 摘要 |
PURPOSE:To avoid elongating the metal wire between an electrode pad and an inner lead and to prevent short between metal wires. CONSTITUTION:The tip of an outside inner lead 5 is so formed that a distance from a semiconductor chip 8 may be away from an inside inner lead 4. An insulative member 3 is fixed on the inside inner lead 4 to separate from the tip of the outside inner lead 5. An outside electrode pad 2 on the semiconductor chip 8 is connected to an inside inner lead 4 with an inner bonding wire 7, and an inside electrode pad 1 to an outside inner lead 5 with an outer bonding wire 6 across the insulative member 3, so that the inner bonding wire 7 and the outer bonding wire 6 generate no short even upon migration in the insulative member 3. |
