| 摘要 |
This is a new epoxy resin composition for sealing semiconductor device, which has a short curing time, an enhanced moisture resistance and improved electrical properties. To product epoxy resin, which composed of epoxy resin, organic flame retardant, inorganic flame retardant, modifier, and other additives, one compound selected from formulas (I) to (IV) is used as a curing agent. The amount of the curing agent used is 3.0-10.0wt.% with respect to the weight of epoxy resin.
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