| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose bonding strength is increased. SOLUTION: The side face part of a package is sealed with a resin 4. The package is a ball grid array which uses a TAB tape 8 as a base. Through-holes which are formed in the TAB tape 8, a stiffener 9 and a heat sink 3 are provided. The resin 4 is sealed into the through-holes. At this time, all four sides in the side face part of the package are sealed. The resin 4 is liquid, and it is hardened in a high-temperature atmosphere, after it is filled to the side face part of the package through a coating operation.
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