CIRCUIT FOR TESTING CONNECTING CONDITION OF BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A circuit for testing the connecting condition of a BGA(Ball Grid Array) package is provided to reducing time for testing and to judge the error of connecting and operating by judging the connecting condition between a solder ball and a board easily. CONSTITUTION: A circuit for testing the connecting condition of a BGA package includes an input pad(10) and an input buffer(30) etc. A drain is connected between the input pad(10) and the input buffer(30) and a transistor(LTR) with the long channel, on the grounding of which a source is connected, is operated by the chip selecting signal(/CS) reversed by the first inverter(INV1). When the high electric potential is input to the input pad(10), the high electric potential is permitted on the output end connected to the node A. While the transistor(LTR) with the long channel turns on slowly, the high electric potential permitted to the input pad(10) is converted into the low electric potential.