| 摘要 |
PROBLEM TO BE SOLVED: To provide a sawing apparatus wherein operation can be exactly, quickly and safely carried out along a cutting mark applied to a part to be cut by sawing in technical fields such as not only lumber processing for building but also cutting various materials by sawing. SOLUTION: A laser beam oscillator 1 for positioning which is fixed to a part just above and opposed to a part 7 to be cut by sawing by putting saw blade 6 between them and a rod lens 2 are provided. By radiating laser beams 3 as linear beams 4 with the rod lens 2, the part 7 to be cut by sawing is projected as two lines 5 and 5 on the part 7 to be cut by sawing. The sawing apparatus is adjusted while this line is adjusted to the cutting mark and saw-cutting operation is carried out.
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