| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive optical component mounting board which can be easily built and excellently mass-produced, and to further provide a highly reliable optical module in which mounting of such an optical component mounting board is easy and resistance to environmental changes is high. SOLUTION: In an optical component mounting board S1, a mounting groove 2 on which an optical waveguide body 11 is disposed and an electrode pad 5 on which an optical semiconductor device 9 to be connected optically to the optical waveguide body 11 is disposed are formed on the board 1. The side on which the electrode pad 5 of the board 1 is formed is held in a package 12 and part of the side on which the loading groove 2 of the board 1 is formed is arranged in an opening 14 formed on the side face of the package 12 so that light is transmitted to the in- and outside of the package 12. A film 6 for sealing the space between the package 12 and the board 1 is formed in the outer peripheral part of the side where the optical waveguide body 11 of the board 1 is arranged. |
