| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing, having excellent adhesion to a semiconductor element and hot strength and excellent solder resistance causing neither cracks nor release from a semiconductor element and a lead frame especially in solder treatment after moisture absorption. SOLUTION: This epoxy resin composition for semiconductor sealing is characterized in that in an epoxy resin composition for sealing a semiconductor apparatus having a lead frame and sealing a semiconductor element, the composition comprises a silane coupling agent as an essential component containing one or more kinds of elements except C, O and H among elements existing on the surface of the semiconductor element. |
