| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can realize a reliable interlayer connection and has high reliability. SOLUTION: The wiring board for manufacturing a multilayer wiring board includes a conductor circuit 109, an insulating layer 102 connected to at least part of the conductor circuit, and a conductor post 102 passed through the insulating layer as extruded from he surface of the insulating layer on a side opposite to the conductor circuit. The conductor post is made of a solder coating, a metallic layer for diffusion prevention, and a copper post sequentially from the surface of its tip end. |
