发明名称 THERMOSOFTENING RADIATION SHEET
摘要 PROBLEM TO BE SOLVED: To provide a radiation sheet which is in the state of a solid sheet at a normal temperature to be easy to mount and attach/detach to/from an electronic component or a heat sink, which is softened by heat generated during the operation of the electronic component to make the level of interfacial contact thermal resistance ignorable and which shows excellent radiation performance through a long period without pumping out. SOLUTION: The radiation sheet to be used mounted between the electronic component and a heat radiating member is a laminated structure body including an intermediate layer (A) composed of a metal foil or metal mesh having 1 to 50μm thickness and 10 to 500 W/mK heat conductivity, and a laminated structure (B) composed of a resin heat conductivity composition formed on both of the surfaces and having >=40 deg.C softening point, viscosity ranging 1×10<2> to 1×10<5> Pa.s at 80 deg.C, and >=1.0 W/mK heat conductivity. The thickness of the whole sheet ranges 40 to 500μm.
申请公布号 JP2002329989(A) 申请公布日期 2002.11.15
申请号 JP20010135506 申请日期 2001.05.02
申请人 SHIN ETSU CHEM CO LTD 发明人 TOMARU KAZUHIKO;YOSHIDA KUNIHIKO;YONEYAMA TSUTOMU
分类号 B32B15/08;C08K3/08;C08K3/20;C08K3/28;C08L23/00;H01L23/36;H01L23/373;H05K7/20;(IPC1-7):H05K7/20 主分类号 B32B15/08
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