| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder land and a soldering structure which can improve easily the reliability of soldering. SOLUTION: An uneven part 7 where an outer peripheral edge of a land periphery 3c is bent internally and externally is formed in the solder land 3. In the soldering structure 1, the solder land 3 in which the uneven part 7 is formed where the outer peripheral edge of the land periphery 3c is bent internally and externally is soldered to a lead 4 of an electronic component by using solder 5 composed of leadless solder. |
