发明名称 |
METHOD FOR PASTING UP FILM |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method capable of simplifying a preparation process and pasting up a film preliminarily cut into a desired dimension on a substrate at a desired position without causing air bubbles or wrinkles. <P>SOLUTION: The film F preliminarily cut into a desired dimension is held on a sheet 16 and the other end side of the film F is lifted up from the substrate 2 with respect to one end side of the aligned film F and one end side of the substrate 2. Then, pressure means 17A and 17B are moved on the sheet from one end side of the film to the other end side thereof to successively paste up the film F on the substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2004358856(A) |
申请公布日期 |
2004.12.24 |
申请号 |
JP20030161487 |
申请日期 |
2003.06.06 |
申请人 |
HITACHI INDUSTRIES CO LTD |
发明人 |
HAYASHI TAKEHIKO;MIYOSHI TETSUYA;HARADA SHIGERU |
分类号 |
B32B37/16;B29C65/78;B29L9/00;(IPC1-7):B29C65/78;B32B31/04 |
主分类号 |
B32B37/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|