发明名称 METHOD AND DEVICE FOR PEELING LAMINATED FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and a device by which a mold releasing layer provided on the surface of a laminated film, such as the used mold releasing film for process etc., can be peeled certainly from the laminated film. <P>SOLUTION: The method includes a step of at least unwinding the laminated film, a step of supplying warm water to the surface of the unwound laminated film, and a step of peeling a surface laminated section from the laminated film. The method also includes a step of winding up a base film after the surface laminated section is peeled. In this method, the surface laminated section is peeled after warm water is brought into contact with the surface of the laminated film for≥2 seconds. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004363140(A) 申请公布日期 2004.12.24
申请号 JP20030156267 申请日期 2003.06.02
申请人 TORAY IND INC 发明人 KAWAZU YUKIO;SUZUKI MOTOYUKI;NAGAI HIROSHI;FURUNO RYOJI
分类号 B32B7/06;B32B18/00;B32B27/00;H01G13/00;(IPC1-7):H01G13/00 主分类号 B32B7/06
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