| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning liquid composition for a semiconductor substrate capable of effectively removing polymers without damaging a metal and an oxide film, a cleaning method of the semiconductor substrate using the same and a manufacturing method of a conductive structure. <P>SOLUTION: The cleaning liquid composition for the semiconductor substrate contains an acidic aqueous solution, an metallic corrosion inhibiting compound expressed by a chemical formula (1) (wherein, R1 to R5 independently represent one of hydrogen, an alkyl group, an aryl group, -(CH<SB>2</SB>)n-COOH, -H<SB>2</SB>PO<SB>3</SB>, or -(CH<SB>2</SB>)n-H<SB>2</SB>PO<SB>3</SB>, a is 1 to 4, b, c and d are each 0 to 2, and b+c+d≥1), and a surface active agent. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
