发明名称 Curable composition
摘要 A curable composition comprising (A) a fluorinated amide compound, (B) a specific fluorinated organohydrogen-siloxane, (C) a platinum group compound, (D) an organosiloxane adhesion-imparting agent, (E) a silica powder having a BET specific surface area of at least 50 m2/g and (F) an organosilane or organosiloxane surface treatment agent for the silica powder provides a cured product endowed with excellent resistance to solvents, chemicals and heat, outstanding low-temperature properties, a low water-vapor permeability and outstanding electrical characteristics. When heated at a relatively low temperature for a relatively short period of time, the composition cures to a form having good adhesion and good durability of adhesion to base materials such as metals and plastics.
申请公布号 US2001018491(A1) 申请公布日期 2001.08.30
申请号 US20010778084 申请日期 2001.02.07
申请人 SHIONO MIKIO;MATSUDA TAKASHI 发明人 SHIONO MIKIO;MATSUDA TAKASHI
分类号 C08G69/48;C08K3/34;C08K3/36;C08L71/00;C08L77/06;C08L83/08;C09J4/00;C09J177/06;C09J183/05;C09J183/06;C09J183/08;C09J183/12;(IPC1-7):C08F8/00 主分类号 C08G69/48
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