Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board

摘要

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device ( 10 ) having a semiconductor chip ( 12 ) with electrodes ( 16 ), a stress-relieving layer ( 14 ) prepared on the semiconductor chip ( 12 ), a wire ( 18 ) formed across the electrodes ( 16 ) and the stress-relieving layer ( 14 ), and solder balls ( 19 ) formed on the wire ( 18 ) over the stress-relieving layer ( 14 ); and a bare chip ( 20 ) as a second semiconductor device to be electrically connected to the first semiconductor device ( 10 ).