| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To secure sufficient reliability in solder mounting of a miniaturized semiconductor device to a mounting board, even in the case of a miniaturized semiconductor device. <P>SOLUTION: The height of the side face terminal at each corner is made higher than the height of the side face terminal 4 on each side. Thereby, even when the height of the side face terminal 4 on each side is lowered in comparison with a conventional one by miniaturization of the semiconductor device or the like, a solder filet 11 greatly affecting reliability can be sufficiently formed between the side face terminal 3 at each corner and the terminal of the mounting board during solder mounting of the device to the mounting board, and reliability in solder mounting of the device to the mounting board can be improved. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
