发明名称 SOLDERING DEVICE FOR ELECTRIC WIRE
摘要 PROBLEM TO BE SOLVED: To provide a soldering device for an electric wire which facilitates the setting work of machining parameters. SOLUTION: The soldering device is provided with a grasping mechanism for grasping the electric wire and a soldering part for automatically adhering solder to the exposed part of a core wire part based on a plurality of preliminarily determined machining parameters for soldering. The soldering device is provided with an input means into which predetermined input parameter values are input, a storage means for storing the relation between preliminarily determined input parameters and the initial value of each machining parameter for soldering, and an initial value calculating means for calculating the initial value of each machining parameter. When the predetermined input parameter values are input into the input means, the initial value calculating means calculates the initial value of each machining parameter based on the relation stored in the storage means. The soldering part automatically adheres the solder to the exposed part of the core wire part based on each machining parameter for soldering which is calculated by the initial value calculating means. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009056486(A) 申请公布日期 2009.03.19
申请号 JP20070225776 申请日期 2007.08.31
申请人 SHIN MEIWA IND CO LTD 发明人 TANIGUCHI TADAAKI;TANIGUCHI TADASHI
分类号 B23K1/00;B23K1/08;B23K3/00;H01R43/02 主分类号 B23K1/00
代理机构 代理人
主权项
地址