<p>A method for manufacturing a semiconductor package is provided to reduce a manufacturing cost by sending a photosensitive film attached to the bottom side of a lead frame to a semiconductor package assembly process. An etching process is performed by attaching first and second photosensitive films in the upper and lower surfaces of a lead frame. A lead frame having a lead with a desired design is made by the etching process. The second photosensitive film attached to the bottom of the lead frame is not removed and the first photosensitive film(28) attached to the upper surface of the lead frame is removed. A semiconductor chip(22) is attached to the chip mounting plate of the lead frame. The bonding pad of the semiconductor chip and each lead are connected by a wire(24). The space between the chip mounting plate and each lead is filled with the molding compound resin. The second photosensitive film(30) is removed from the bottom sides of the chip mounting plate and each lead.</p>
